ITO GLASS

GLASS COMPOSITION (TYPICAL, % BY WEIGHT)	SODA LIME
AI2 O3	1.0 -1.9
CaO	7.-12
FE2 O3	0.08 - 0.14
MgO	1.0 - 4.5
Na2 O + K2 O	13 -15
SO4	0 - 0.3
SiO2	70-73

	SODA LIME
Alkali attack DINISO695/DIN52322	1
Acid resistance DIN12116	3
Hydrolytic resistance ISO709/DIN12111	3

		SODA LIME
Density	103 kg/m3	2.498
Young’s Modulus	103 kg/mm2	7.5
Poisson Ratio		0.22
Vickers Hardness	103 kg/mm2	0.63
Shear Modulus	103 kg/mm2
Thermal Expansion	10–6 /K	8.5 – 9.0
	at °C	20 – 350
Specific Heat	Cal/g°C	0.18
	at °C	0 – 50
Thermal Conduct	Kcal/m h °C	0.65
Strain Point	°C	523
Softening Point	°C	525 - 555
Annealing Point	°C	720 – 740
Transmittance	%	≥ 90
Refractive Index		1.517

	SODA LIME
Volume resistivity / log Ω cm
At 20 °C	13.5
At 50 °C	12
At 100 °C	10
At 200 °C	7.3
At 300 °C	5.6
Dielectric constant	7.6 (at 1 kHz)
Dielectric loss (tan Ø)	0.02 (at 1 kHz)

Properties
Thickness (specified)	nm ≥ 20λ
Thickness (typical)	nm 23
Barrier efficiency (Na ion diffusion)	μg/cm2 ≤ 0.1
Transmittance at l = 550nm	% ≥ 89
Refractive index at l = 632.8nm typical	1.5
Chemical resistance in HF	nm/min ≤ 20 (linear part)
Chemical resistance in HF for VIS V	nm/min ≤ 25 (linear part)
Adhesive tape test	ok
Rubber test	ok

The coating will be removed completely when placed in an unagitated solution with the constituents and temperature as specified below. Sufficient deionized water rinsing after etching is essential.
Fully oxidized ITO
HGI Etchant
Hydrochloric acid con c. > 32% Vol %	48.1
Nitric acid con c. 65 % Vol %	3.8
Deionized water Vol %	48.1
Temperature ° C	45± 1
Etch time	Sec/nm ITO thickness ≤ 3.5
HBr Etchant
Hydrobromic acid con c. 48%	Vol % 100
Temperature ° C	45± 1
Etch time	Sec/nm ITO thickness ≤ 1
Partially oxidized ITO
HCI Etchant
Hydrochloric acid con c. > 32%	Vol % 14.5
Nitric acid con c. 65 %	Vol % 0.5
Deionized water	Vol % 85.0
Temperature	° C 25± 2
Etch time	Sec/nm ITO thickness ≤ 0.5

Oxidation: Recommended oxidation of partially oxidized ITO in circulated air oven with ambient air 390°C / 30 min

Common Properties
Etchability in HCI	Nm/sec ≥ 0.3 (linear part)
Etchability in HBr	Nm/sec ≥ 1.0 (linear part)
Refractive index at = 632.8nm typical	1.85
Chemical resistance in NaOH
- change of sheet resistance	% ≤ 10
- change of appearance	none
Temperature stability (change of sheet resistance)After cycle at 300 °C, 30 min.	% ≤ 250
Humidity stability – change of sheet resistance	% ≤ 10
Adhesive tape test	Ok
Rubber test	Ok

WHILE EVERY ATTEMPT HAS BEEN MADE TO VERIFY THE SOURCE OF THE INFORMATION, NO RESPONSIBILITY IS ACCEPTED FOR ACCURACY OF DATA.