UQG Optics

ITO GLASS
MATERIAL DATA
GLASS COMPOSITION (TYPICAL, % BY WEIGHT) SODA LIME
AI2 O3 1.0 -1.9
CaO 7.-12
FE2 O3 0.08 - 0.14
MgO 1.0 - 4.5
Na2 O + K2 O 13 -15
SO4 0 - 0.3
SiO2 70-73

CHEMICAL RESISTANCE (TYPICAL)
  SODA LIME
Alkali attack DINISO695/DIN52322 1
Acid resistance DIN12116 3
Hydrolytic resistance ISO709/DIN12111 3

PHYSICAL PROPERTIES (TYPICAL)
    SODA LIME
Density 103 kg/m3 2.498
Young’s Modulus 103 kg/mm2 7.5
Poisson Ratio   0.22
Vickers Hardness 103 kg/mm2 0.63
Shear Modulus 103 kg/mm2  
Thermal Expansion 10–6 /K 8.5 – 9.0
  at °C 20 – 350
Specific Heat Cal/g°C 0.18
  at °C 0 – 50
Thermal Conduct Kcal/m h °C 0.65
Strain Point °C 523
Softening Point °C 525 - 555
Annealing Point °C 720 – 740
Transmittance % ≥ 90
Refractive Index   1.517

ELECTRICAL PROPERTIES (TYPICAL)
  SODA LIME
Volume resistivity / log Ω cm  
At 20 °C 13.5
At 50 °C 12
At 100 °C 10
At 200 °C 7.3
At 300 °C 5.6
Dielectric constant 7.6 (at 1 kHz)
Dielectric loss (tan Ø) 0.02 (at 1 kHz)

BARRIER COATING - SiO2
Properties  
Thickness (specified) nm ≥ 20λ
Thickness (typical) nm 23
Barrier efficiency (Na ion diffusion) μg/cm2 ≤ 0.1
Transmittance at l = 550nm % ≥ 89
Refractive index at l = 632.8nm typical 1.5
Chemical resistance in HF nm/min ≤ 20 (linear part)
Chemical resistance in HF for VIS V nm/min ≤ 25 (linear part)
Adhesive tape test ok
Rubber test ok

ETCHING
The coating will be removed completely when placed in an unagitated solution with the constituents and temperature as specified below. Sufficient deionized water rinsing after etching is essential.
Fully oxidized ITO
HGI Etchant  
Hydrochloric acid con c. > 32% Vol % 48.1
Nitric acid con c. 65 % Vol % 3.8
Deionized water Vol % 48.1
Temperature ° C 45± 1
Etch time Sec/nm ITO thickness ≤ 3.5
HBr Etchant  
Hydrobromic acid con c. 48% Vol % 100
Temperature ° C 45± 1
Etch time Sec/nm ITO thickness ≤ 1
   
Partially oxidized ITO
HCI Etchant  
Hydrochloric acid con c. > 32% Vol % 14.5
Nitric acid con c. 65 % Vol % 0.5
Deionized water Vol % 85.0
Temperature ° C 25± 2
Etch time Sec/nm ITO thickness ≤ 0.5

Oxidation: Recommended oxidation of partially oxidized ITO in circulated air oven with ambient air 390°C / 30 min

TRANSPARENT CONDUCTIVE COATING – FULLY OXIDIZED ITO
Common Properties  
Etchability in HCI Nm/sec ≥ 0.3 (linear part)
Etchability in HBr Nm/sec ≥ 1.0 (linear part)
Refractive index at = 632.8nm typical 1.85
Chemical resistance in NaOH  
    - change of sheet resistance % ≤ 10
    - change of appearance none
Temperature stability (change of sheet resistance)After cycle at 300 °C, 30 min. % ≤ 250
Humidity stability – change of sheet resistance % ≤ 10
Adhesive tape test Ok
Rubber test Ok


WHILE EVERY ATTEMPT HAS BEEN MADE TO VERIFY THE SOURCE OF THE INFORMATION, NO RESPONSIBILITY IS ACCEPTED FOR ACCURACY OF DATA.