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Glass Ceramics
Optical Filters
Optical Glasses
Optical Materials
Technical Glasses
AR Coated Glass
Corning
Flashed White Opal
ITO Glass
Leadglass Xray Protection
Pilkington
Schott
Sodalime floatglass
ITO GLASS
MATERIAL DATA
GLASS COMPOSITION (TYPICAL, % BY WEIGHT)
SODA LIME
AI
2
O
3
1.0 -1.9
CaO
7.-12
FE
2
O
3
0.08 - 0.14
MgO
1.0 - 4.5
Na
2
O + K
2
O
13 -15
SO
4
0 - 0.3
SiO
2
70-73
CHEMICAL RESISTANCE (TYPICAL)
SODA LIME
Alkali attack DINISO695/DIN52322
1
Acid resistance DIN12116
3
Hydrolytic resistance ISO709/DIN12111
3
PHYSICAL PROPERTIES (TYPICAL)
SODA LIME
Density
10
3
kg/m
3
2.498
Young’s Modulus
10
3
kg/mm
2
7.5
Poisson Ratio
0.22
Vickers Hardness
10
3
kg/mm
2
0.63
Shear Modulus
10
3
kg/mm
2
Thermal Expansion
10
–6
/K
8.5 – 9.0
at °C
20 – 350
Specific Heat
Cal/g°C
0.18
at °C
0 – 50
Thermal Conduct
Kcal/m h °C
0.65
Strain Point
°C
523
Softening Point
°C
525 - 555
Annealing Point
°C
720 – 740
Transmittance
%
≥ 90
Refractive Index
1.517
ELECTRICAL PROPERTIES (TYPICAL)
SODA LIME
Volume resistivity / log Ω cm
At 20 °C
13.5
At 50 °C
12
At 100 °C
10
At 200 °C
7.3
At 300 °C
5.6
Dielectric constant
7.6 (at 1 kHz)
Dielectric loss (tan Ø)
0.02 (at 1 kHz)
BARRIER COATING - SiO2
Properties
Thickness (specified)
nm ≥ 20λ
Thickness (typical)
nm 23
Barrier efficiency (Na ion diffusion)
μg/cm
2
≤ 0.1
Transmittance at l = 550nm
% ≥ 89
Refractive index at l = 632.8nm typical
1.5
Chemical resistance in HF
nm/min ≤ 20 (linear part)
Chemical resistance in HF for VIS V
nm/min ≤ 25 (linear part)
Adhesive tape test
ok
Rubber test
ok
ETCHING
The coating will be removed completely when placed in an unagitated solution with the constituents and temperature as specified below. Sufficient deionized water rinsing after etching is essential.
Fully oxidized ITO
HGI Etchant
Hydrochloric acid con c. > 32% Vol %
48.1
Nitric acid con c. 65 % Vol %
3.8
Deionized water Vol %
48.1
Temperature ° C
45± 1
Etch time
Sec/nm ITO thickness ≤ 3.5
HBr Etchant
Hydrobromic acid con c. 48%
Vol % 100
Temperature ° C
45± 1
Etch time
Sec/nm ITO thickness ≤ 1
Partially oxidized ITO
HCI Etchant
Hydrochloric acid con c. > 32%
Vol % 14.5
Nitric acid con c. 65 %
Vol % 0.5
Deionized water
Vol % 85.0
Temperature
° C 25± 2
Etch time
Sec/nm ITO thickness ≤ 0.5
Oxidation: Recommended oxidation of partially oxidized ITO in circulated air oven with ambient air 390°C / 30 min
TRANSPARENT CONDUCTIVE COATING – FULLY OXIDIZED ITO
Common Properties
Etchability in HCI
Nm/sec ≥ 0.3 (linear part)
Etchability in HBr
Nm/sec ≥ 1.0 (linear part)
Refractive index at = 632.8nm typical
1.85
Chemical resistance in NaOH
- change of sheet resistance
% ≤ 10
- change of appearance
none
Temperature stability (change of sheet resistance)After cycle at 300 °C, 30 min.
% ≤ 250
Humidity stability – change of sheet resistance
% ≤ 10
Adhesive tape test
Ok
Rubber test
Ok
WHILE EVERY ATTEMPT HAS BEEN MADE TO VERIFY THE SOURCE OF THE INFORMATION, NO RESPONSIBILITY IS ACCEPTED FOR ACCURACY OF DATA.