Dicing


UQG Optics offers precision dicing services on customer-supplied materials, substrates and components. Our cutting technology incorporates vision alignment systems and high-resolution closed loop linear positioning encoders.

We can cut to high tolerances and offer an express service to the micro electronics and optical industry.  Our equipment includes a Loadpoint NanoAce 3300 and a MicroAce machine. One off R&D jobs are undertaken to volume production.

Dicing Capabilities:

  • Saws are fully CNC programmable
  • Full cut through, scribed, bevelled and trenching, edges polished
  • Thicknesses cut from 100 microns to 6mm
  • Dicing tolerance to 10 microns
  • Material/component size up to 300mm dia – 200mm square
  • Kerf/blade material loss: 100-300 microns

Materials & Components:

  • Coated filters
  • Ceramics & alumina
  • Fused silica & quartz
  • Optical glasses
  • Borosilicate
  • Sodalime glass
  • Sapphire
  • Germanium
  • Silicon
  • Wafers
  • Ferrites
  • Front surface mirrors
  • Glass substrates
  • Colour glass filters
  • Small diameter rods

Applications Include:

  • Nanotechnology
  • Biotechnology
  • Photonics/optics
  • Semiconductor
  • Medical
  • Sensor
  • Optical components
  • Electronics

Shipping & Packaging

Waffle packs & trays, Gel packs, On tape & ring, manual sorted and loaded, UV & non UV dicing tape.