UQG Optics offers precision glass dicing services and for customer-supplied materials, substrates and components. Our cutting technology incorporates vision alignment systems and high-resolution closed loop linear positioning encoders.
We dice to high tolerances and offer an express service to the micro electronics and optical industry. Our equipment includes a Loadpoint NanoAce 3300 and a MicroAce machine. One off R&D jobs are undertaken to volume production.
Dicing Capabilities:
- Saws are fully CNC programmable
- Full cut through, scribed, bevelled and trenching, edges polished
- Thicknesses cut from 100 microns to 6mm
- Dicing tolerance to 10 microns
- Material/component size up to 300mm dia – 200mm square
- Kerf/blade material loss: 100-300 microns
Materials & Components Dicing:
- Coated filters
- Ceramics & alumina
- Fused silica & quartz
- Optical glasses
- Borosilicate
- Sodalime glass
- Sapphire
- Germanium
- Silicon
- Wafers
- Ferrites
- Front surface mirrors
- Glass substrates
- Colour glass filters
- Small diameter rods
Applications Include:
- Nanotechnology
- Biotechnology
- Photonics/optics
- Semiconductor
- Medical
- Sensor
- Optical components
- Electronics
Shipping & Packaging
Waffle packs & trays, Gel packs, On tape & ring, manual sorted and loaded, UV & non UV dicing tape.