Dicing

UQG offers precision dicing services in a controlled clean room environment. Dicing a broad range of customers supplied materials and components. Supplying R+D/Prototypes to production quantities in a quick turnaround service.

DICING CAPABILITIES Saws fully CNC programmable Full cut through, scribed, bevelled and trenching Squares and rectangles: 300 microns to 100mm Thickness: 100 microns to 4mm Dicing tolerance: To 10 microns Material/Component size: up to 6"/152mm dia Kerf/Blade material loss: 100-300 microns

MATERIALS & COMPONENTS Coated Filters Ceramics & Alumina Fused Silica & Quartz Optical Glasses Borosilicate Sodalime Glass Sapphire Germanium Silicon Wafers Ferrites Front Surface Mirrors

SHIPPING & PACKAGING Waffle packs & trays Gel Packs On Tape & ring, manual sorted and loaded	APPLICATIONS INCLUDE Nanotechnology Biotechnology Photonics/Optics Semiconductor Medical Sensor Optical Components Electronics