Dicing
UQG offers precision dicing services in a controlled clean room environment. Dicing a broad range of customers supplied materials and components. Supplying R+D/Prototypes to production quantities in a quick turnaround service.

DICING CAPABILITIES
  • Saws fully CNC programmable
  • Full cut through, scribed, bevelled and trenching
  • Squares and rectangles: 300 microns to 100mm
  • Thickness: 100 microns to 4mm
  • Dicing tolerance: To 10 microns
  • Material/Component size: up to 6"/152mm dia
  • Kerf/Blade material loss: 100-300 microns
    • MATERIALS & COMPONENTS
  • Coated Filters
  • Ceramics & Alumina
  • Fused Silica & Quartz
  • Optical Glasses
  • Borosilicate
  • Sodalime Glass
  • Sapphire
  • Germanium
  • Silicon
  • Wafers
  • Ferrites
  • Front Surface Mirrors
    • SHIPPING & PACKAGING
  • Waffle packs & trays
  • Gel Packs
  • On Tape & ring, manual sorted and loaded
    • APPLICATIONS INCLUDE
  • Nanotechnology
  • Biotechnology
  • Photonics/Optics
  • Semiconductor
  • Medical
  • Sensor
  • Optical Components
  • Electronics
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